We specialized in the production and sale of vacuum applied systems,DXF-560 Magnetron and Ion Beam Compound System, can be customized according to various vacuum applied systems,DXF-560 Magnetron and Ion Beam Compound System, if you need to know more vacuum applied systems,DXF-560 Magnetron and Ion Beam Compound System relations information, please contact us.
Products:
Home > vacuum applied systems > DXF-560 Magnetron and Ion Beam Compound System

DXF-560 Magnetron and Ion Beam Compound System

Application

It is apply for the preparation nanoscale monolayer and multilayer functional film, hard film, metal film, semiconductor film, dielectric film, ferromagnetic films, magnetic films and so on. It can be widely applied for the areas of semiconductor, microelectronics and new materials .

Composition

The system mainly consists of main sputtering vacuum chamber, magnetron sputtering target, substrate water-cooling heat revolution plate, Kaufman ion gun, 4 stations rotating targets, working gas circuit, pumping system, vacuum measurement and electronic control system.

 

DXF-560 Magnetron and Ion Beam Compound System

DXF-560 Magnetron and Ion Beam Compound System

Technical Index

Model DXF-560
Size of Vacuum Chamber Upright cylindrical, Ø550*450mm
Configuration of Vacuum System Compound molecular pump, mechanical pump, slide valve
Ultimate Pressure ≤6.67*10-5Pa (after bake and degassing)
Time of Recovery Vacuum Reach 6.6*10-4Pa in 40 mins ( expose in air for short time and inflate dry chlorine and then begin air exhaust)
Substrate Water-cooling Heat Revolution Plate Substrate Structure 6 stations and one for installation of heating furnace other for water cooling substrate plate
Sample Size Ø30mm. It could accept 6 pieces
Mode of Motion 0-360°back and front rotating
Heat MAX. heat temperature of substrate 600℃±1℃
Negative Substrate Bias -200V
Component of Magnetron Targets Four permanent targets, target size: Ø60mm (One among them could sputter magnetic material.) Radio sputtering of each target and direct current sputtering are compatible. The distance between target and sample is 40-80mm, which is adjustable.
Component of 4 Stations Rotating Targets Target size: 70*70mm
Main Sputtering Ion Gun Diameter of  extraction grid: Ø30mm, energy of ion beam:0.4-2.0Kev continuously adjustable, density of ion beam: 1-5mA/cm3
Aux desiment ion gun Diameter of  extraction grid: Ø30mm, energy of ion beam:0.4-1.5Kev continuously adjustable, density of ion beam: 1-3mA/cm3
Air Circuit System Quality flow controller 3 channel
computer Control System Control target baffle, 4 stations rotation target change target, sample baffle and the temperature control of sample
Floor Space Mainframe 1300*850mm2
Electric Control Cabinet 700*700mm2(2 sets)

 

 

 

 

 

Home > vacuum applied systems > DXF-560 Magnetron and Ion Beam Compound System