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DXPE Series Plasma Chemical Vapor Deposition Coating Equipment
Application
It applies for preparing various dielectric film, semiconducting film and so on according to reactant gas in vacuum condition. It provides ideal producing method for new materials and films scientific research field.
Composition
It mainly consists of vacuum chamber, upper cover components, sample heating plate, vacuum measurement system, air circuit system, electronic control system, rack system and so on.
DXPE Series Plasma Chemical Vapor Deposition Coating Equipment
Technical Index
Vacuum Chamber | Upright cylindrical structure, size: Ø400*300mm | |
Configuration of Vacuum System | Lobe pump, mechanical pump, molecular pump, slide valve | |
Ultimate Pressure | ≤6.67*10-5Pa (after bake and degassing) | |
Time of Recovery Vacuum | Reach 6.6*10-4Pa in 40 mins ( expose in air for short time and inflate dry chlorine and then begin air exhaust) | |
Substrate Heat Plate | Sample Size | Ø100mm |
Heat | MAX. heat temperature of substrate 400℃±1℃ | |
Negative Substrate Bias | ≤-300V | |
Air Circuit System | Quality flow controller 4 channel | |
Floor Space | Mainframe | 1100*860mm2 |
Electric Control Cabinet | 700*700mm2 (1 set) | |
Air Circuit Cabinet | 1200*600mm2(1 sets) |
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